Investigation on metallurgical properties and electromigration in AlCu metallizations for VLSI applications
| Author: | Stefan Dietrich, M. Schneegans, Michael Moske, Konrad SamwerORCiDGND |
|---|---|
| Frontdoor URL | https://opus.bibliothek.uni-augsburg.de/opus4/23041 |
| ISSN: | 0040-6090OPAC |
| Parent Title (English): | Thin Solid Films |
| Publisher: | Elsevier |
| Place of publication: | Amsterdam |
| Type: | Article |
| Language: | English |
| Year of first Publication: | 1996 |
| Release Date: | 2017/07/21 |
| Volume: | 275 |
| Issue: | 1-2 |
| First Page: | 159 |
| Last Page: | 163 |
| DOI: | https://doi.org/10.1016/0040-6090(95)07032-X |
| Institutes: | Mathematisch-Naturwissenschaftlich-Technische Fakultät |
| Mathematisch-Naturwissenschaftlich-Technische Fakultät / Institut für Physik |
