Temperature dependence of residual stresses in capped blanket Cu films of various thicknesses
| Author: | G. Langelaan, S. Saimoto, Michael Moske |
|---|---|
| Frontdoor URL | https://opus.bibliothek.uni-augsburg.de/opus4/24373 |
| ISBN: | 9781558993310OPAC |
| ISSN: | 0272-9172OPAC |
| Parent Title (English): | Materials reliability in microelectronics VI: symposium held April 8-12, 1996, San Francisco, California, USA |
| Publisher: | Materials Research Society |
| Place of publication: | Pittsburgh, PA |
| Editor: | William F. Filter |
| Type: | Conference Proceeding |
| Language: | English |
| Year of first Publication: | 1996 |
| Release Date: | 2017/07/21 |
| Series: | Materials Research Society symposia proceedings ; 428 |
| Institutes: | Mathematisch-Naturwissenschaftlich-Technische Fakultät |
| Mathematisch-Naturwissenschaftlich-Technische Fakultät / Institut für Physik |
